PM lays foundation stone for three semiconductor plants worth ₹1.26 lakh crore

Prime Minister Narendra Modi on Wednesday laid the foundation stone for three semiconductor projects worth around ₹1.27 lakh crore.

The three sites are Dholera Special Investment Region (DSIR) in Dholera, Gujarat; Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat; and OSAT facility at Morigaon, Assam.

The semiconductor fabrication facility at DSIR will be set up by Tata Electronics Private Limited (TEPL) and its partner Powerchip Semiconductor Manufacturing Corporation (PSMC) of Taiwan, under the modified scheme for setting up semiconductor fabs in India. At ₹91,000 crore investment, it will be the country’s first commercial semiconductor fab.

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Similarly, the OSAT facility in Morigaon will be set up by TEPL under the modified scheme for semiconductor assembly, testing, marking and packaging (ATMP), with an investment of about ₹27,000 crore.

The OSAT facility in Sanand will be set up by CG Power and Industrial Solutions Limited along with its Japanese partner Renesas Electronics, under the ATMP scheme, with an investment of about ₹7,500 crore.

“Since 1962, India has been trying to set up semiconductor industry, we are getting successful today… it is all because of a decisive leadership. The generations to come in future will remember this historical day. Today at one go, there are three foundation laying ceremony for semiconductor units and including the recent Micron project… India’s semiconductor industry will kick off,” Ashwini Vaishnaw, Minister of Communications and Information Technology, and Railways, said here.

N Chandrasekaran, Chairman, Tata Sons, said the Tata units will create 50,000 jobs in future and supply chips to automotive, medical devices, defence and consumer electronics sectors.