Xiaomi’s XRING In-House Chips Could Power More Phone Tiers

Xiaomi’s XRING In-House Chips Could Power More Phone Tiers

Xiaomi surprised users last week with the introduction of the Xiaomi 15S Pro and Pad 7 Ultra models. The tech giant made history by becoming the first Chinese company to enter mass production using the 3nm processor manufacturing process. While the Xiaomi XRING O1 chip is currently used in flagship smartphones, the brand may equip more affordable models with its own chips in the future.

XRING O1 is just the beginning: more Xiaomi smartphones may use in-house chips

Reports indicate that Xiaomi won’t limit its chipset efforts to the XRING O1. While the Xiaomi 15S Pro and Pad 7 Ultra target the high-end segment, the brand is reportedly planning to launch custom chipsets for entry-level and mid-range devices in the future.

However, this isn’t something that will happen overnight. The company claims its focus is on flagship devices, as this is the most difficult terrain. If all goes well, the company could build on that foundation to work on chips for other ranges, says Lu Weibing, president of Xiaomi. With its XRING O1 processor, Xiaomi has proven it can compete with the likes of Qualcomm, MediaTek, Apple, and Samsung.

First comes Xiaomi’s own modem

Meanwhile, Xiaomi’s next immediate step after the XRING O1 is to develop its own modem. This would be similar to what Apple did with the C1 5G baseband chip.

It will probably take Xiaomi a few years to launch its own 5G modem. As we know, Apple spent years developing its modem and faced numerous challenges along the way. In fact, a Xiaomi executive recently stated that they’re still at the beginning of the journey, which supports this outlook. In short, the Chinese company may face similar difficulties.

There’s no official word yet on when Xiaomi will bring its own processors to affordable models. However, sources predict this could happen with the launch of XRING O1’s successors.

Things to know about XRING O1

Xiaomi builds its XRING O1 chip using TSMC’s second-generation 3nm process. Featuring 19 billion transistors, the processor supports 5G, Wi-Fi, and Bluetooth connectivity through its MediaTek-based modem.

The chipset features a 10-core architecture, including 2 high-performance Cortex-X925 cores (3.9 GHz), 4 Cortex-A725 or X4 cores (3.4 GHz), 2 Cortex-A720 or A725 cores (1.89 GHz), and 2 power-efficient Cortex-A520 cores (1.8 GHz). It comes equipped with a 16-core Immortalis-G925 GPU.

This article first appeared on Android Headlines

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